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Printed Circuit Board PCB for Medical Apparatus and Instruments
Aug 20, 2017


Product Detail

Basic Info

  • Model NO.:PCB

  • Type:Rigid Circuit Board

  • Dielectric:FR-4

  • Material:Fiberglass Epoxy

  • Flame Retardant Properties:V0

  • Mechanical Rigid:Rigid

  • Processing Technology:Electrolytic Foil

  • Base Material:Copper

  • Insulation Materials:Epoxy Resin

  • Copper Thickness:1 Oz

  • Board Thickness:0.2mm

  • Surface Finish:HASL

  • Silk Screen:White

  • Solder Mask:Green

  • Trademark:xcepcb

  • Specification:UL, ROHS, ISO9001, 94v0

  • Origin:Shenzhen, China

  • HS Code:8534009000


Files Gerber, Protel, Powerpcb, Autocad, Orcad, etc
MaterialHigh frequency Material (Rogers, Teflon, Taconic)
Layer No. 1 - 16 Layers
Board thickness 0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance ±10%
Copper thickness 0.3OZ - 4OZ
Impedance Control ±10%
Warp and Twist ≤0.075%
Peel Strength ≥61B/in(≥107g/mm)
Min Trace Width (a) 3mil
Min Space Width (b) 3mil
Min Annular Ring 0.004"(0.1mm)
SMD Pitch (a) 0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) 0.027"(0.675mm)
Register tolerance 0.05mm
Min Solder Mask Dam (a) 0.005"(0.125mm)
Solder mask Clearance (b) 0.005"(0.125mm)
Min SMT Pad spacing (c) 0.004"(0.1mm)
Solder Mask Thickness 0.0007"(0.018mm)
Hole size 0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-) ±0.003"(±0.0762mm)
Max PTH Aspect Ratio 10:1
Hole Registration 0.003"(0.075mm)
HASL 2.5um
Lead free HASL 2.5um
Immersion Gold Nickel  3-7um  Au:1-3u''
OSP 0.2-0.5um
Panel Outline Tol (+/-) ±0.004''(±0.1mm)
Beveling 30°45°
V-cut 15° 30° 45° 60°
Surface finish HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate  ROHS  ISO9001 TS16949  SGS  UL
Special requirements Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger



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