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Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
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TEL: +86-755-26055813
FAX: +86-755-26055946
Email:sales3@xcepcb.com
Audio Customized Rogers/Teflon/Iteq High Frequency PCB Board
Jul 28, 2017

Basic Info

  • Model NO.: pcb-753

  • Application: Consumer Electronics

  • Base Material: Rogers

  • Brand: xinchenger

  • Land Area of Our Factory: More Than 10000 Square Meter

  • Layer No.: 1-16

  • Finished Board Thickness: 0.2 mm-3.8mm′(8 Mil-150 Mil)

  • Certificate: RoHS, ISO9001:2008, SGS, UL Certificate

  • Specification: TS16949, SGS, ISO14000, RESCH, RoHS

  • Type: Rigid Circuit Board

  • Processing Technology: Electrolytic Foil

  • We Found: in 2002

  • Business Nature: Manufacturing of Printed Circuit Board

  • Cooper Thickness: 0.5 Oz-11oz (18 Um-385 Um)

  • Laminate Materials:Rogers,Taconic,Isola,Arlon,Teflon

  • Trademark: XCE

  • Origin: Shenzhen


Product Description

We are the Printed Circuit Boards(PCB) manufacturer with 15 years experience, specialized in single-sided, 2-layerd, multilayer and high density interconnector (HDI) PCB.

Certification: UL, ISO14001, ISO9001, SGS, TS16949
Used for auto industry, high power led, electric toy, machinery, industrial lighting and so on.

Our process capability

DescriptionCapability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Board Max. Size1200mm×600mm
PCB Board Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
Outline ToleranceRouting:±0.1mm (±4mil)  ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
TypeSingle-sided, double-sided, multi-layer
Major Materialhigh frequency laminates, Rogers,Taconic
Thickness0.2-3.5mm
Base Copper Thickness11um  35um  70um  105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10%  2.Hardness:6H  3.bearable friction times :above 200000 times

What we need:
Please tell us the information as below:

Board for what productSurface Finish
Number of LayersBoard Material
Copper Thickness(um)Board Thickness(um)
Solder Mask ColorPCB Dimensions(mm)
Silk Screen ColorMin Finished Hole Size(mm)
MillingMin Clearance(mm)
Min Track Width(mm)Other special requirements


Fast delivery:

PackagingVacuum Packing with desiccant,
Professional Export Carton.




Delivery
time

 
Prototype   Mass production
(above 30m)
2LQuick turn:24h
Usual time:3-4days
5-10days
4LQuick turn:48 hours;
Usual time:5-6days
8-15days
6LQuick turn:72 hours;
Usual time:6-8days
10-16days
8LQuick turn:72 hours;
Usual time:8-10days
16-18days
10LQuick turn:96 hours;
Usual time:12-14days
18-20days
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