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4-Layer Multilayer 2oz PCB for Communication Filter Plate
Aug 10, 2017

Basic Info

  • Model NO.: XCE01391

  • Dielectric: FR-4

  • Application: Industrial Control

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: Xce

  • Board Thickness1.6mm: Enig

  • Min Hole Size 0.3mm: Outer Copper Thickness 140um

  • Transport Package: Vaccume Package

  • Origin: Guangdong, China

  • Type: Rigid Circuit Board

  • Material: Fiberglass Epoxy

  • Flame Retardant Properties: V0

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Epoxy Resin

  • 4layers: Fr4-Tg170

  • Green Sodermask: White Silkscreen

  • Trademark: XCE

  • Specification: ROHS

  • HS Code: 8534009000


Specification:
Layer:4
Material type: FR-4-TG170
Board thickness: 1.6 mm
Outer Copper thickness: 4 OZ(140um)
Copper thickness in hole :> 25.0 um (>1mil)
Size - Max. Board Size: 23 × 25 (600mm×1000mm)
- Min. Drilled Hole Size: 12mil (0.3mm)
- Min. Line Width: 4mil (0.1mm)
- Min. Line Spacing: 4mil (0.1mm)
Surface finishing :ENIG
Solder Mask Color: Green
Silkscreen: White
PCB Packing - Inner packing: Vacuum packing / plastic Bag
- Outer packing: Standard carton packing
Certificate: UL, ISO 9001, ISO 14001,TS16949
Special requirements: Buried and blind vias+controlled impedance +BGA
Profiling: Routing, V-CUT


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