Model NO.: xce15120801
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Insulation Materials: Epoxy Resin
Board Thickness: 3.2mm
Surface Finishing: Lead Free Hal
Min Hole Size: 0.4mm
Transport Package: Vacunm Packing
Type: Rigid Circuit Board
Material: Fiberglass Epoxy
Mechanical Rigid: Rigid
Base Material: Copper
Tg Value: Tg170
Copper Thickness: 3oz
Min Line W/S: 12/12 Mil
Specification: CE, RoHS, SGS
HS Code: 8534009000
|Surface Finishing||Lead Free HAL|
|Min Line Width/Space||12/12 mil|
|Min Hole Size||0.4mm|
UL (E246887), ISO9001, TS16949, ISO 14001 certified.
Turnover USD 50-100 million per year
25,000 sqm area,1100 staff
Mass Production from single to 20 layers
Special Material: ROGERS, Arlon, Taconic.etc.
Client: SAMSUNG, Skyworth, Malata, Midea.etc.
Q1:Are you a manufacturer or trading company?
A:XCE is a PCB manufacturer, specialized in PCB for over ten years.
Q2:What kind of PCB file you need before production?
A:Gerber, or files like PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350.etc.
b. Dimensional Specifications
c. BOM List (only for PCBA)
Q3: How long will you send us quotation ?
A: After all files were sent, 2 to 8 hours as per your file.
Q4:What is your minimum order quantity?
A:Our MOQ is 1 PCS.