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Teflon High Frequency PCB Fabrication Gold Plated 1.8mm Thickness

Teflon High Frequency PCB Fabrication Gold Plated 1.8mm Thickness

Electronic Component, Main Board, PCB manufacturer / supplier in China, offering Competitive Price PCB for Air Conditioner with 1oz Cooper, Impedance Controlled PCB Printed Circuit Board with UL, High Quality LED PCB Flex Circuit and so on.

Product Details
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you teflon high frequency pcb fabrication gold plated 1.8mm thickness with competitive price. Just be free to buy good teflon high frequency pcb fabrication gold plated 1.8mm thickness at reasonable price with us and get the datasheet from our suppliers who can working for you.

 

Teflon High Frequency PCB Fabrication With Gold Plated 1.8mm Thickness

 

Specification:


Board size: 3*4 cm                                              

                

Board thickness: 1.8mm

 

Copper foil: 3OZ

 

Layer: 2

 

Model: XCEH


High frequency material in stock:

 

BrandModelThickness(mm)DK(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO40030.254 0.508,0.813,1.5243.38
RO43500.254 0.508,0.762,1.5243.5
RO58800.254.0.508.0.7622.2
RO30030.127,0.508,0.762,1.5243
RO30100.63510.2
RO32060.635MM10.2
R030350.508MM3.5
RO60100.635MM, 1,27MM10.2
TACONICTLX-8.TLX-90.508. 0.7622.45-2.65
TLC-320.254,0.508,0.7623.35
TLY-50.254,0.508.0.8,2.2
RF-60A0.254.0.508.0.7626.15
CER-100.254.0.508.0.76210
RF-300.254.0.508.0.7623
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2

 

 

Description:

 

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.









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