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Taconic CER-10 Immersion Silver High Frequency PCB

Taconic CER-10 Immersion Silver High Frequency PCB

High frequency PCB Manufacturer,Good Price,High Quality Rogers PCB manufacturer/supplier in China,offering 4 Layer Fr4 PCB Immersion Gold,High Quality 2 Layer Rigid Fr4+Rogers Blue Soder Mask PCB,Double Sided Fr4 PCB Board

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Product Details

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you taconic cer-10 immersion silver high frequency pcb with competitive price. Just be free to buy good taconic cer-10 immersion silver high frequency pcb at reasonable price with us and get the datasheet from our suppliers who can working for you.


Detailed Product Description

Permittivity:10

Base Material:CER-10

Surface Finish:Immersion Silver

Layer Of Number:4

Board Size:28*12cm

Copper THK:1OZ


Permittivity ER=10 Taconic PCB CER-10  Based On Military Grade Material

Specification:

Board size28*12cmBoard thickness1.2mm
Layer4Base materialtaconic
Min line space5milMin line width5mil
BrandXCETOriginChina

 

Application:

High Power Amplifier

Repeater

Phase Shifter

Antenna

Filters and Coupler

Passive Components

 

Xinchenger Electronics(HK) Co.,Ltd has been manufacturing rigid high frequency printed circuit boards since 2002;we are one of the oldest most experienced independent manufacturers of high frequency printed circuit boards in Chinese.

Xinchenger Electronics(HK) Co.,Ltd provides a wide range of manufacturing services from double sided to high layer count/high density multi-layer printed circuit boards.Xinchenger Electronics(HK) Co.,Ltd can seamlessly transition customers from quick–turn prototypes to cost effective volume production while mitigating risk and uncertainty.


Manufacturing FeaturesManufacturing Capabilities
I/L Trace and Space 0.5 oz. cu.003/.003
O/L Trace and Space 0.5 oz. cu.003/.003
I/L Etched Feature Tolerance {+/-}.0005
O/L Etched Feature Tolerance {+/-}.001
Smallest drilled via .062 thickness.005
Smallest drilled via .093 thickness.008
Smallest drilled via .130 thickness.011
IPC Class 2, {.001} Annular Ring O/L.010 over finished hole size
IPC Class 3, {.002} Annular Ring O/L.012 over finished hole size
IPC Class 2, {.001} Annular Ring I/L.010 over drill diameter
IPC Class 3, {.002} Annular Ring I/L.012 over drill diameter
Layer to Layer Registration {+/-}.003
Dimensional Feature to Feature {+/-}.003
Solder Mask Dam Width Min..003
Solder Mask Clearance Tolerance {over pad}.003
Solder Mask Registration Tolerance.002
Plated Hole Tolerance {+/-}.002
Maximum Aspect Ratio12:1
Maximum Board Thickness.150
Minimum Board Thickness.016
Minimum Dielectric Core Thickness.002
Maximum Layer Count24
Maximum Panel Size21 x24
Impedance Control Tolerance {+/-} Single Ended, Edge Coupled, Broad Sided Differential+/- 7%
Maximum Bow and Twist< 0.75%
Materials
RogersYes
FR4,High TGYes
Taconic
Yes
Isola
Yes
F4B
Yes
Surface Finishes
HASL {Hot Air Solder Level}Yes
Lead Free HASLYes
Immersion SilverYes
Immersion TinYes
Immersion nickel gold {ENIG}Yes
Electrolytic Plated Gold TabsYes
Electrolytic Full Body GoldYes
Electrolytic NickelYes
OSP {Organic Solderability Preservative}Yes
Mixed Surface Finishes Example: Electrolytic Nickel And EnigYes
Special Processes
Carbon InkYes
Via FillYes
Sequential LaminationYes

















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