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Taconic 6 Layer High Frequency PCB HF Custom Printed Circuit Boards Manufacturing Process

Taconic 6 Layer High Frequency PCB HF Custom Printed Circuit Boards Manufacturing Process

Taconic PCB,High Frequency PCB,Electrical Design/RF&Wireless Design

Product Details
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you taconic 6 layer high frequency pcb hf custom printed circuit boards manufacturing process with competitive price. Just be free to buy good taconic 6 layer high frequency pcb hf custom printed circuit boards manufacturing process at reasonable price with us and get the datasheet from our suppliers who can working for you.

Detailed Product Description

Layer Of Number:6

Surface Finish:ENIG

Base Material:Taconic TLY-5

Cu THK:1OZ

Board THK:0.2mm

 


Specification:

 

Materia raw

Taconic TLY-5

Board THK

0.6mm

Layer

6

Solder mask

white

Surface finish

ENIG

Line space

0.1mm

Copper THK

1OZ

Line width

0.1mm

 

Parameter

 

XCE PCB technical specifications

Material

Taconic TLY-5

Layer No.

6

Min board thickness 

2 layer0.2mm                                                                 

4 layer0.4mm                                                                    

6 layer 0.6mm                                                                

8 layer 0.8mm                                                               

10 layer 1.0mm

Max panel size

508*610mm

Board thickness tolerance

T≥0.8mm±8%.,T<0.8mm±5%

Wall hole copper thickness

>0.025mm(1mil)

Finished hole

0.2mm-6.3mm

Min line width

4mil/4mil(0.1/0.1mm)

Min bonding pad space

0.1mm(4mil)

PTH aperture tolerance

±0.075mm(3mil)

NPTH aperture tolerance

±0.05mm(2mil)

Hole site deviation

±0.05mm(2mil)

Profile tolerance

±0.10mm(4mil)

Board bend&warp

≤0.7%

Insulation resistance

>1012Ωnormal

Through-hole resistance

<300Ωnormal

Electric strength

>1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity 

>6H

Thermal stress

288℃20Sec

Testing voltage

50-300V

Min buried blind via

0.2mm(8mil)

Outer copper thickness

1oz-5oz

Inner cooper thickness

1/2 oz-4oz

Aspect ratio

8:1

SMT min green oil width

0.08mm

Min green oil open window

0.05mm

Insulation layer thickless

0.075mm-5mm

Taphole aperture

0.2mm-0.6mm

Special technology

Indepedance,Blind buried via,thick gold,aluminum PCB

Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin, 

Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 












 

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