Home > Products > High Frequency PCB

Product Categories

CONTACT US
Add: Bld 60, Zhongwu Industrial Park, Xixiang, Baoan, Shenzhen, Guangdong, China
M.B: +86-13603055201
TEL: +86-755-26055813
FAX: +86-755-26055946
Email:sales3@xcepcb.com

Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board

Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board

Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board Specification: High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can...

Product Details

Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board


Specification:

High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.



Advantage

 

Hybrid Laminate High Frequency PCB With Electrolytic Gold 4 Layer Board

1.Sufficient high frequency material raw

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours.

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting


6360944485325603028685144.png



Reference - our production capability for rigid PCB:

Layers: 1 to 28

Board finished thickness: 0.2 to 7.0mm

Materials: FR4,Rogers,Taconic

Max. finished board size: 23 x 25 (580 x 900mm)

Min. drilled hole size: 3mil (0.075mm)

Min. line width: 3mil (0.075mm)

Min. line spacing: 3mil (0.075mm)

Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold

Immersion Silver/gold,OSP, gold plating

Copper thickness: 0.5-7.0oZ

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0μm (>1mil)

Inner packing: Vacuum packing/plastic bag

Outer packing: Standard carton packing

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS

Special requirements: buried and blind Vias + controlled impedance + BGA

Profiling: Punching, routing, V-CUT, beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products



psb.jpg


High Thermal Performance

Tg of 200 (DSC), 230°C (DMA)

Low CTE for reliability

Lead-free Compatible & Rhos Complaint

UV Blocking and AOI Fluorescence

Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat


PrePreg Material

It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.


Parameter:

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling


Main Export Markets:

Eastern Europe

North America

Mid East/Africa

Western Europe

Asia

Central/South America

Primary Competitive Advantages:

Experienced Staff

Green Product

Packaging

Price

Prompt Delivery

Quality Approvals

Small Orders Accepted




Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you hybrid laminate high frequency pcb with electrolytic gold 4 layer board with competitive price. Just be free to buy good hybrid laminate high frequency pcb with electrolytic gold 4 layer board at reasonable price with us and get the datasheet from our suppliers who can working for you.
Hot Tags: hybrid laminate high frequency pcb with electrolytic gold 4 layer board manufacturer, suppliers, factory, datasheet, buy, price
Related Products
Quick Navigation
  • About Us
  • Products
  • News
  • Exhibition
  • Contact Us
  • Capability
  • Newsletter
    Enter in your email address to receive deals and coupons.
    +86-755-26055813
    +86-755-26055946 sales3@xcepcb.com
    http://cs.ecqun.com/mobile/rand?id=3826129