Detailed Product Description Material:Taconic Layer:4 Color:Blue Min Line Space:5mil Min Line Width:5mil Copper Thickness:2OZ Board Size:105*58.9mm Panel:1 Surface:ENIG Other:Impedance Control
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Detailed Product Description
Min Line Space:5mil
Min Line Width:5mil
We have sufficient rogers material raw as follow:
TLY-5A TLY-5 TLY-3 HT1.5
TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27
TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30
TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A
RF-35P RF-41 RF-43 RF-45 RF-60A CER-10
High Speed Design Frequency PCB Board TACONIC high-performance insulating material for microwave,
radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.
This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,
And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
Taconic materials are UL 94V-0 rated for active devices and high power RF designs.
High Speed Design Frequency PCB Board Special high electromagnetic frequency circuit boards,
in general, can be defined as the frequency of the high frequency of 1GHz.
Its physical properties, precision, technical parameters required is very high,
commonly used in automotive anti-collision systems, satellite systems, radio systems, etc.
Cellular Base Station Antennas and Power Amplifiers
Microwave point to point (P2P) links
Automotive Radar and Sensors
low dielectric loss
RF Identification (RFID) Tags
The stability of the dielectric constant
An extremely low water imbibition
LNB’s for Direct Broadcast Satellites
Microwave Antenna 4 Layer PCB Board,
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to
gigahertz frequency ranges (medium frequency to extremely high frequency).
These frequency ranges are used for communication signals in everything from cellphones to military radars.
The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er),
loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for
high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.
These materials can be mixed in the same Stack-Up for optimal performance and economics.