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High Frenquency Rogers HF PCB For 3G / 4G LTE Mobile Base Station Antenna Equipment

High Frenquency Rogers HF PCB For 3G / 4G LTE Mobile Base Station Antenna Equipment

Printed Circuit Board,PCB,Circuit PCB manufacturer/supplier in China,offering High Frenquency Rogers HF PCB For 3G / 4G LTE Mobile Base Station Antenna Equipment Green Solder Madk,Impedance Controlled PCB Printed Circuit Board with UL

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Product Details

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you high frenquency rogers hf pcb for 3g / 4g lte mobile base station antenna equipment with competitive price. Just be free to buy good high frenquency rogers hf pcb for 3g / 4g lte mobile base station antenna equipment at reasonable price with us and get the datasheet from our suppliers who can working for you.


Rogers PCB For 3G / 4G  LTE Mobile Base Station Antenna Equipment

Quick detail:

2 layer

Copper thickness: 3OZ

Board thickness: 1.8MM

Green solder mask, 

white silk screen

Model: XCER

Size: 10*8cm

Origin: China

 

FilesGerber, Protel, Powerpcb, Autocad, Cam350, etc
MaterialFR-4,High frequency Material (Rogers, Teflon, Taconic,F4B)
Layer No.1 - 30 Layers
Board thickness0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance±10%
Copper thickness0.5OZ - 4OZ
Impedance Control±10%
Warpage0.075%-1.5%
Peelable0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)0.005"(0.125mm)
Min Space Width (b)0.005"(0.125mm)
Min Annular Ring0.005"(0.125mm)
SMD Pitch (a)0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)0.027"(0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005"(0.125mm)
Soldermask Clearance (b)0.005"(0.125mm)
Min SMT Pad spacing (c)0.004"(0.1mm)
Solder Mask Thickness0.0007"(0.018mm)
Hole size0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)±0.003"(±0.0762mm)
Aspect Ratio6:01
Hole Registration0.004"(0.1mm)
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au:1-3u''
OSP0.2-0.5um
Panel Outline Tol (+/-)±0.004''(±0.1mm)
Beveling30°45°
V-cut15° 30° 45° 60°
Surface finishHAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate ROHS  ISO9001:2000  TS16949  SGS  UL
Special requirementsBuried and blind vias, Impedance control, via plug, BGA soldering and gold finger


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4. Distributorship are offered for your unique design and some our current models

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