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High Density Multilayer PCB Design

High Density Multilayer PCB Design

Fr4 PCB, Multilayer PCB, Prototype PCB manufacturer / supplier in China, offering High Density Multilayer PCB Design, OSP Quick Turn Printed Circuit Boards, PCBA Bom Gerber Files USB Flash Drive PCBA and so on.

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Product Details
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you high density multilayer pcb design with competitive price. Just be free to buy good high density multilayer pcb design at reasonable price with us and get the datasheet from our suppliers who can working for you.
Basic Info
  • Model NO.: Multilayer PCB Design

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Processing Technology: Electrolytic Foil

  • Base Material: Copper

  • Brand: XCE

  • Layer Count: 1-22 Layers

  • Copper Thickness: 0.5-6 Oz

  • Surface Treatment: HASL Lead Free

  • Silk Screen: White, Black

  • Specification: CE, ISO, UL

  • HS Code: 8466940090

  • Structure: Multilayer Rigid PCB

  • Material: Epoxy Paper Laminate

  • Flame Retardant Properties: V0

  • Production Process: Additive Process

  • Insulation Materials: Organic Resin

  • Kind: Rigid PCB

  • Board Thickness: 0.5-5.0mm

  • Board Material: Fr4

  • Solder Mask: Green, Bule, Red, Black, Yellow, White

  • Trademark: XCE

  • Origin: China(Mainland)


1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

Antenna Radio FM Rogers 3003 High Frequency PCB With Half Hole In 0.79mm Thickness

Space Saving Circuitry

Patch Antennas

Satellite Communications Systems

Power Amplifiers

Aircraft Collision Avoidance Systems

Ground Radar Warning Systems

Datalink on cable systems

Remote meter readers

Power backplanes

LMDS and wireless broadband

Base station infrastructure

Electronic equipment is the development trend of high-frequency, especially in the wireless network, the growing development of satellite communications, information products to high

Speed and high-frequency, and communications products to the capacity of large-speed wireless transmission of voice, video and data standardization.

Of the new generation products need high-frequency substrate, satellite systems, mobile phone base stations and other communications products must be used to receive high-frequency circuit

Board, in the next few years will inevitably rapid development of high-frequency substrate will be a lot of demand.

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