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DK 3.38 Rogers 4003C Custom PCB Circuit Board for Radio frequency / Microwave

DK 3.38 Rogers 4003C Custom PCB Circuit Board for Radio frequency / Microwave

Rogers4003 PCB,Radio frequency/Microwave Printed Circuit Board,Electrical Design/RF&Wireless Design

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Product Details

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you dk 3.38 rogers 4003c custom pcb circuit board for radio frequency / microwave with competitive price. Just be free to buy good dk 3.38 rogers 4003c custom pcb circuit board for radio frequency / microwave at reasonable price with us and get the datasheet from our suppliers who can working for you.


Detailed Product Description

Base Material:Rogers

Solder Mask:Green

Board THK:0.032 Inch

Type:High Frequency

Board Size:0.5*0.5 Cm

Copper THK:1OZ

Layer:2

Min Line Space:8mil

Min Line Width:8 Mil

Panel:6*7

Origin:China

Delivery:DHL,Fedex,TNT Etc.

 

DK = 3.38 Rogers 4003C RF / Microwave PCB Circuit Boards Maker

Material

FR4(standard)

Isola 

FR4(Hi-Tg)

Isola

Rogers

RO4003/4350/3010/RT Duroid 5880/5870

Arlon

Diclad 25N/25FR/870/880

Taconic

TLY/TLC/RF35/RF30

F4B

F4B

FR4

Di-electric materials:FR4

Copper weight

1 ~ 5 oz  internal & external layers

Drilling

Min. Drilled Hole Size

10 mil( 6 ~ 8 mil finished)

Annular Ring

5 mil(normal)/4 mil (for Laser vias)

Registration

± 3 mil

Max. Aspect Ratio

10 :1

Hole Size Tolerance

+/- 3 mils (PTH);+/- 2 mils(N-PTH)

Hole Roughness

< 0.8 mil

Min. Cu Plating in Holes

> 0.8mil,  Ave. 1 mil

 Laser drill

 available

Image Transfer

Min. Trace and space

4/4 mil

SMT / BGA.Pitch

10 mils for SMT/30 mils for BGA

Trace/space Tolerance

±20%(or +/- 10% per IPC class 3)

Solder Mask

LPI Solder Mask

Green(glossy or matte), Blue, Red, Black, Yellow

Via Plugging

min. 80% filled

Solder Mask ink

Taiyo & Tamura

Registration

± 2 mil

Min Solder Dam

2.5 mil

Thickness

0.5 ~1.5 mil

Silkscreen

White, Yellow, Black

Min. silkscreen width

8 mil

CNC Dimension

± 5 mil

Punch Dimension

± 4 mil

Blind Vias / Buried Vias

Yes

VIP (Via in Pad)

Yes (Non-conductive epoxy resin-filled or Cu filled)

Impedance control


± 10%

Surface Finish

HASL

200 ~ 500 μ"

Pb free HASL

100 ~ 500 μ"

Immersion Gold

1 ~ 5 μ"

Immersion Silver

6 ~ 12 μ"

Immersion Tin

25 ~ 40 μ"

Electolytic Gold

Yes

Gold Finger Plating

5 ~ 40 μ"

OSP(Entek)

yes

Solder Mask Coating Method

Silkscreen printing (Double or triple coatings available)

Carbon Ink

20 Ω

Peelable mask

Thickness = 0.3 mm

Pumice Pre-treatment

Available











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