Product Details Key Specifications/Special Features: Material: High Frequency Layer count: 2 Board thickness: 1.6mm Surface technique: immersion Tin ENIG: industrial test and control with gold connectors Base materials: high temperature FR4,rogers, arlon and other Teflon Layers: 1 to 40 layers...
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you 2 layer high frequency pcb in immersion tin with competitive price. Just be free to buy good 2 layer high frequency pcb in immersion tin at reasonable price with us and get the datasheet from our suppliers who can working for you.
Material: High Frequency
Layer count: 2
Board thickness: 1.6mm
Surface technique: immersion Tin
ENIG: industrial test and control with gold connectors
Base materials: high temperature FR4,rogers, arlon and other Teflon
Layers: 1 to 40 layers standard PCB, blind via and buried via board
Minimum hole size: 0.4mm
Board thickness: 0.4-3.2mm
Finishes: HAL, lead-free HAL, organic OSP, hard and soft gold plating tin, immersion silver, immersion tin and electro less nickel immersion gold
Optimized cost and RF / microwave performance
Compatible with FR-4 fabrication including multilayer PCB constructions
High thermal conductivity for improved thermal management over traditional PTFE materials
Robust lead-free solder processing compatibility
Low Z-axis CTE for reliable plated through-hole quality
Cellular Base Station Antennas and Power Amplifiers
Microwave point to point (P2P) links
Automotive Radar and Sensors
RF Identification (RFID) Tags
LNB’s for Direct Broadcast Satellites
Country of Origin
Small Orders Accepted
Payment Method:Telegraphic Transfer (TT,T/T)
Minimum Order:1 Pieces
FOB Range: US$ 1 - US$ 5 per unit (Pieces)
Lead Time: 2-5 days
RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal.
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon
and other dedicated microwave substrates.
RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be
separated from the RF part.
4, To choose the components working in high frequency environment
should use of surface-mount component as far as possible.
Because the surface-mount component is small volume generally and the pin of component
is very short.
ShenZhen Xinchenger Electronics Co.,Ltd