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High TG PCB

High Tg PCB General Info Tg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected. Also there re a lot of...

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Product Details

High Tg PCB General Info


Tg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.


Also there re a lot of different hi-tg material not listed here, different country, different company prefer using different material. Please view datasheet for each of them to choose most suitable material for you. If without special notice, normally we will use S1170 from SYL.


170Tg is also popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you d better use Ceramic boardwhich can go through -55~880C. 


Please contact us for more information about Hi Tg circuit board.

High Tg materials have the following properties:

  • High glass flow temperature value (Tg)

  • High temperature durability

  • Long delamination durability

  • Low Z axis expansion (CTE)



What is high Tg PCB (printed circuit board)

In recent years, there are more and more customers request to manufacture PCB with high Tg, in the following we would like to describe what is high Tg PCB.


TG means Glass Transition Temperature Temperatures that are associated with long term operations must be considered in the manufactured of printed circuit boards that will be exposed to high thermal loads.. The function of a circuit board will be affected if its temperature exceeds the designated Tg value. You can count on Super PCB for a high TG PCB that won’t fail you.


Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 – 140℃, High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB. As the rapid development of electric industry, especially for the computer as the representative of electronic products, developing toward the high performance, high multilayer requires PCB substrate material with higher heat resistance to ensure high reliability. On the other hand, as a result of development of SMT, CMT with high density pcb assembly technology, the PCB manufacturing with small hole size, fine lines and thin thickness are more and more inseparable from the support of high heat resistance.


If the Tg of PCB substrate is increased, the heat resistance, moisture resistance, chemical resistance and stability of printed circuit boards will be improved as well. The high Tg applicates more in the lead free pcb manufacturing process


 Therefore, the difference between general FR4 and high Tg FR4 is, in the hot state, especially in the heat absorption with moisture, the high Tg PCB substrate will perform better than general FR4 in the aspects of mechanical strength, dimensional stability, adhesiveness, water absorption and thermal decomposition.


High Tg refers to the high heat resistance.With the rapid development of electronic industry, especially the electronic products represented by computer, toward high function, high multiple stratification, need PCB substrate material of higher heat resistance is an important guarantee.Represented by SMT, CMT s emergence and development of high density installation technology, make the PCB in the small aperture, fine lines, thin, more and more inseparable from the support substrate, high heat resistance.


Commonly so FR - 4 and the difference between high Tg FR - 4: is under the hot, especially in the heat after moisture absorption, its material mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion situations vary, such as high Tg products is significantly better than the ordinary PCB substrate materials.


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Details

Description

Layer

Single Layer

Material

FR4

Board Thinckness

1.2MM

Size

12*9CM

Solder Mask

Green

Silkscreen

White

Finish Copper Thinckness

35μm/35μm

Surface Finish

HASL

Board Thinckness Tolerance

±10%

Impedance Control

±10%

Warp & Wist

0.70%

Testing

100% Electric Test, IPC Class II.



FR4 - Glass laminates are widely used for subtractive Printed Circuit Board fabrication because of their ability to meet a wide variety of processing conditions. Thermally stable copper-clad epoxy-glass laminates offer high mechanical strength and machinability and outstanding electrical characteristics. Designed for single and double-sided boards, they provide a combination of processing flexibility and finished board performance needed for many SMT applications. 


HiTg FR4 - A high Tg is very important for the PCBs to guard against barrel cracking and pad fracture during the soldering process. 

  • High quality PCB prototypes to production

  • Lead free/RoHS PCBs are available

  • All boards are UL approved

  • All boards are manufactured under IPC-A-600 specifications and guidelines

  • Affordable pricing

  • On time delivery

  • Circuit Board Materials (FR4, HiTg FR4, Cem-1, Polyimide, etc.)

  • Multilayer printed circuit boards

  • Prototypes to Full Volume Production

  • Flexible Printed Circuit Boards


Products Details

Raw Material

FR-4 (Tg 130 available)

Layer Count

Single Sided

Board Thickness

1.2mm

Copper Thickness

1.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales
       Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,
       BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE



Products Details

Raw Material

FR-4 (Tg 180 available)

Layer Count

4-Layer

Board Thickness

1.2mm

Copper Thickness

3.0oz

Surface Finish

Immersion Gold (Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

700×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales
     Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,
     BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE


         Standard FR-4 Material Properties

           Performance characteristics

Glass Transition Temperature (Tg)

150Tg or 170Tg

Decomposition Temperature (Td)

> 325℃

Coefficient of Thermal Expansion (CTE)

3.0%-3.8%

Dielectric Constant (@1 GHz)

4.25-4.55

Dielectric Constant (@55 GHz)

≤5.5

Dissipation Factor (@ 1 GHz)

0.016

Water imbibition (D - 24/23, the thickness of 1.6 mm)

≤19mg

Laminate thickness

0.005"~ 0.125"

Combustibility

FV0

Density

1.70-1.90g/cm&sup3

 Vertical Layer To The Bending Strength A

Normal :E-1/150,150±5℃≥340Mpa

Parallel To The Floor To The Impact Strength (beam)

≥233KJ/m

Execution Standard

GB/T1303.1-1998

After Flooding Insulation Resistance

D-24/23):≥5.0×108Ω

Vertical layer to the electric strength (in the middle of 90 + 2 ℃ for transformer oil, thickness 1 mm)

≥14.2MV/m

Parallel layer to the breakdown voltage (90 + 2 ℃ in the transformer oil)

≥40KV


Material

TG (DSC,°C)

Td (Wt,°C)

CTE-z (ppm/°C)

Td260 (min)

Td288 (min)

S1141 (FR4)

175

300

55

8

/

S1000-2M (FR4)

180

345

45

60

20

IT180

180

345

45

60

20

Rogers 4350B

280

390

50

/

/


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