FR4 HDI PCB Printed circuit boards High Density Interconnect HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias. HDI PCB...
FR4 HDI PCB Printed circuit boards
High Density Interconnect
HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias. HDI PCB manufacturing is a growing area since the market demand for lightweight and thinner PCBs that can handle high-speed signals with reduced signal loss has steadily increased as consumer electronic end-products are produced in smaller form factors.
As a result of the market demand for HDI PCB manufacturing, XCEPCBhas served clients from many industries, including:
Automotive (Engine Control Units, GPS, Dashboard Electronics)
Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)
Communication (Mobile phones, Modules, Routers, Switches)
Digitial (Cameras, Audio, Video)
FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as "copperclad laminates."
FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards. More sophisticated and complex FR-4 printed circuit boards are produced in multiple layers, also known as "multilayer circuitry".
When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.
In the USA, FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254µm) to 3 inches (76 mm).
In the USA, copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2(300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1µm (1.34 thou), 68.2µm (2.68 thou), and 102.3µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35µm (may also be referred to as 35 μ, 35 micron, or 35 mic).
1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side.
1/1 - denotes 1 oz/ft2 copper on both sides.
H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively.
2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively.
Our manufacturing facilities have the following HDI PCB manufacturing capabilities:
Buried, Blind and Micro Vias
FR-4 (Tg 170 available)
ENIG(Electroless Nickel Immersion Gold)
Min. Trace Width/Spacing
Min. Hole Size
Hole Wall Copper Thickness
Inner: Vacuum-packed in soft plastic bales
Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Buried And Blind Via, Impedance Control, Via Plug,
Annual stock Material
Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Min board thickness
Max panel size
Board thickness tolerance
Wall hole copper thickness
Min line width
Min bonding pad space
PTH aperture tolerance
NPTH aperture tolerance
Hole site deviation
Min buried blind via
Outer copper thickness
Inner cooper thickness
SMT min green oil width
Min green oil open window
Insulation layer thickless
Indepedance,Blind buried via,thick gold,aluminum PCB
HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you hdi pcb with competitive price. Just be free to buy good hdi pcb at reasonable price with us and get the datasheet from our suppliers who can working for you.