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HDI PCB

FR4 HDI PCB Printed circuit boards High Density Interconnect HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias. HDI PCB...

Product Details

FR4 HDI PCB Printed circuit boards


High Density Interconnect 

HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias. HDI PCB manufacturing is a growing area since the market demand for lightweight and thinner PCBs that can handle high-speed signals with reduced signal loss has steadily increased as consumer electronic end-products are produced in smaller form factors.
As a result of the market demand for HDI PCB manufacturing, XCEPCBhas served clients from many industries, including:


  • Automotive (Engine Control Units, GPS, Dashboard Electronics)

  • Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)

  • Communication (Mobile phones, Modules, Routers, Switches)

  • Digitial (Cameras, Audio, Video)


FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as "copperclad laminates." 


FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards. More sophisticated and complex FR-4 printed circuit boards are produced in multiple layers, also known as "multilayer circuitry". 


Specifications
When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately. 


In the USA, FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254µm) to 3 inches (76 mm).
In the USA, copper foil thickness is specified in units of
ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2(300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1µm (1.34 thou), 68.2µm (2.68 thou), and 102.3µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35µm (may also be referred to as 35 μ, 35 micron, or 35 mic). 


1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side.
1/1 - denotes 1 oz/ft2 copper on both sides.
H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively.
2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively.
Our manufacturing facilities have the following HDI PCB manufacturing capabilities:


  • Buried, Blind and Micro Vias

  • NCVF

  • Copper Fill

  • Sequential Lamination

  • 3/3 Traces/Space

  • 5% Impedance

 

Products Details


  Raw Material

FR-4 (Tg 170 available)

Layer Count

4-Layer

Size

18*26cm

Board Thickness

1.2mm

Copper Thickness

1.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Blue

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales
  Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,
  BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE


Technical specifications

Annual stock Material

Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free

Layer No.

1~16

Min board thickness

2 layer0.2mm                                
  4 layer0.4mm                                  
  6 layer 0.6mm                                
  8 layer 0.8mm                                
  10 layer 1.0mm

Max panel size

508*610mm

Board thickness tolerance

T≥0.8mm±8%.,T<0.8mm±5%

Wall hole copper thickness

>0.025mm(1mil)

Finished hole

0.2mm-6.3mm

Min line width

4mil/4mil(0.1/0.1mm)

Min bonding pad space

0.1mm(4mil)

PTH aperture tolerance

±0.075mm(3mil)

NPTH aperture tolerance

±0.05mm(2mil)

Hole site deviation

±0.05mm(2mil)

Profile tolerance

±0.10mm(4mil)

Board bend&warp

≤0.7%

Insulation resistance

>1012Ωnormal

Through-hole resistance

300Ωnormal

Electric strength

>1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity

>6H

Thermal stress

288℃20Sec

Testing voltage

50-300V

Min buried blind via

0.2mm(8mil)

Outer copper thickness

1oz-5oz

Inner cooper thickness

1/2 oz-4oz

Aspect ratio

8:1

SMT min green oil width

0.08mm

Min green oil open window

0.05mm

Insulation layer thickless

0.075mm-5mm

Taphole aperture

0.2mm-0.6mm

Special technology

Indepedance,Blind buried via,thick gold,aluminum PCB

Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you hdi pcb with competitive price. Just be free to buy good hdi pcb at reasonable price with us and get the datasheet from our suppliers who can working for you.

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