FR4 4 Layer BGA Immerison Gold PCB 1.6mm TG170 Circuit specification: layer: multilayer material: fr4 Tg value: tg135-tg180 board thickness:1.6mm copper thickness:.1.5oz surface treatment:ENIG Quick detail: Origin:China Special: FR4 Material Layer:4 Thickness:1.6mm Surface: ENIG Hole:0.5
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FR4 4 Layer BGA Immerison Gold PCB 1.6mm TG170 Circuit
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:ENIG
Quick detail:
Origin:China
Special: FR4 Material
Layer:4
Thickness:1.6mm
Surface: ENIG
Hole:0.5
Specification:
Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.
Parameter:
oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size:(580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance:±0.13
13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,
Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias
+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling
UL 94: Test for Flammability of Plastic Materials for Parts in Devices and Appliances
Level test program are as follows:
1) HB Grade: horizontal burning test Horizontal Burning Test
2) V0-V2 level: vertical flame test Vertical Burning Test
3) 5VA / 5VB: 5V-fire test 500w (125 mm) Vertical Burning Test
4) RP Class: radiant panel flame spread testing Radiant Panel Flame Spread Test
5) VTM0-VTM2: thin material vertical combustion test Thin Material Vertical Burning Test
6) HF1-HF2: foam level material combustion test Horizontal Burning Foamed Material Test
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
Website:www.fr4-pcb.com/www.xce-pcb.com
