FR4 4 Layer BGA Immersion Gold PCB 1.6mm TG170 Circuit

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FR4 4 Layer BGA Immerison Gold PCB 1.6mm TG170 Circuit

specification:

layer: multilayer

material: fr4

Tg value: tg135-tg180

board thickness:1.6mm

copper thickness:.1.5oz

surface treatment:ENIG

Quick detail:

Origin:China

Special: FR4 Material

Layer:4

Thickness:1.6mm

Surface: ENIG

Hole:0.5

Specification:

Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board 

Green Soldermask White Silkscreen,

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, 

with electronic level glass fiber cloth as reinforcing material of substrate. 

Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material 

in production of multilayer printed circuit board,

This kind of product is mainly used for double-sided PCB, dosage is very large. 

Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, 

in recent years because of the electronic product installation technology 

and PCB technology development needs, appeared high Tg FR - 4 products.

Parameter:

oItemData

1Layer:1 to 24 layers

2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

3Board thickness:0.20mm to 3.4mm

4Copper thickness:0.5 OZ to 4 OZ

5Copper thickness in hole:>25.0 um (>1mil)

6Max. Board Size:(580mm×1200mm)

7Min. Drilled Hole Size:4mil(0.1mm)

8Min. Line Width:3mil (0.075mm)

9Min. Line Spacing:3mil (0.075mm)

10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, 

                                           Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

11Solder Mask Color:Green/Yellow/Black/White/Red/Blue

12Shape tolerance:±0.13

13Hole tolerance:PTH: ±0.076 NPTH: ±0.05

14Package:Inner packing: Vacuum packing / Plastic bag,

                                Outer packing: Standard carton packing

15Certificate:UL,SGS,ISO 9001:2008

16Special requirements:Buried and blind vias

                                                 +controlled impedance +BGA

17Profiling:Punching, Routing, V-CUT, Beveling

UL 94: Test for Flammability of Plastic Materials for Parts in Devices and Appliances

Level test program are as follows:

1) HB Grade: horizontal burning test Horizontal Burning Test

2) V0-V2 level: vertical flame test Vertical Burning Test

3) 5VA / 5VB: 5V-fire test 500w (125 mm) Vertical Burning Test

4) RP Class: radiant panel flame spread testing Radiant Panel Flame Spread Test

5) VTM0-VTM2: thin material vertical combustion test Thin Material Vertical Burning Test

6) HF1-HF2: foam level material combustion test Horizontal Burning Foamed Material Test

Karen-Sales Department

ShenZhen Xinchenger Electronics Co.,Ltd

sales3@xcepcb.com

Skype:karen-xcepcb

Website:www.fr4-pcb.com/www.xce-pcb.com