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6 Layer Immersion Gold Green Printed Circuit Board

6 Layer Immersion Gold Green Printed Circuit Board

PCB, Multilayer PCB, Printed Circuit Board manufacturer / supplier in China, offering 6 Layer Immersion Gold Printed Circuit Board, 2 Layer Immersion Silver Quick Turn Around PCB

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Product Details
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you 6 layer immersion gold green printed circuit board with competitive price. Just be free to buy good 6 layer immersion gold green printed circuit board at reasonable price with us and get the datasheet from our suppliers who can working for you.

Basic Info

  • Model NO.: XCEPCB

  • Dielectric: FR-4

  • Application: Consumer Electronics

  • Processing Technology: Electrolytic Foil

  • Base Material: Copper

  • Brand: XCE

  • Trademark: XCE

  • Origin: Shenzhen, China

  • Structure: Multilayer Rigid PCB

  • Material: Epoxide Woven Glass Fabric Laminate

  • Flame Retardant Properties: V0

  • Production Process: Subtractive Process

  • Insulation Materials: Organic Resin

  • Test: Flying Probe and Test Frame

  • Specification: RoHS

  • HS Code: 8534001000

Product Description

Layer: 6 Layer
Finished Board thickness:  1.6mm
Board Materials: FR-4
Brand: KB
Tg value: 140
Finished copper thickness: 2 OZ
Surface treatment: Immersion gold
Solder  mask:green
Min hole size:0.2mm
Min trace width and space:3/3MIL

Company Advantages:
Our company product focus on quick turn around PCB ,small and medium volume PCB,1- 30 layer board including High density interconnection board ,High frequency , High TG, impedance control,thick copper. 
And we are able to  manufacturing double-sided sample board within one day,4 layer and 6 layer sample board within 2 days.

LayerTypeDelivery time
2 layerSample board1day
4 layerSample board2days
6 layerSample board2days

Technical Capability:

Max layers30 layers
Max panel size600*650mm
Board thicknessCore thickness:0.15-3.20mm,finished board thickness:0.30-6.00mm
Min spacing0.10mm/4mil
Min line width0.10mm/4mil
Min hole0.15mm/6mil
Surface treatmentHAL-lead free,ENIG,OSP,Electrolytic Gold(120 U''),immersion tin,immersion silver,Gold-finger(120 U'' gold thickness)
Minimum pad0.35mm/18mil
Minimum solder mask bridge3mil(0.076mm)
Aspect ratio10:1
Outline tolerance+/-4mil(+/-0.1mm)
Hole Wall Copper Thickness0.025mm/1mil
Aperture tolerance±0.05mm/2mil
Thermal Shock288oC,10S,Three times


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